AMPM Series

Anode Moving Plating Equipment

Fine Pattern

Appliccation

- FMM, RDL, PLP

- Custommization Available : Board Size, Thickness, Lay-out, Capacity, etc

Specification

- Size : 4.5G (920mm X 730mm)~, 0.5t Glass Base. (More Big Size Available)

- Uniformity : 8㎛ ± 3%

- Pitch : 10㎛ / 10㎛

- Plating Material : Cu, INVAR