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PCCP (VCP) Series
VCP Type Cu Plating Equipment
MSAP,Coreless of PCB ProductionFine Pattern
Application
- HID, PKG ,FPCB
- Panel Fill,Pattern Fill,TH
- Custommization Available: Board Size, Thickness, Lay-out, Capacity, etc
Specification
- Control for Minimizing gaps of panels (※ Anti Back Unit)
- Improving Plating quality via individual DC Current control
(※ Layered Anode)Uniformity : 8㎛ ± 3%- Minimizing Human Errors
(※ Auto Loading Unit & R/S Auto Make up - System)- Pointec Holds a number of patents & Know-How about VCP